Process Hierarchy

on front
  Solder bonding (vacuum, with alignment)
on front
  1 Solder deposition
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Batch size 2
Bonded materials
Pair of materials bonded by this process
gold
Pressure
Pressure of process chamber during processing
0.1 mTorr