|
| Process characteristics: |
| Duration Duration os SEM inspection |
|
|---|
| Batch size |
1 |
|---|
| Magnifications |
100 .. 500000 |
|---|
| Sides inspected The sides of the wafer inspected by the process |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Hitachi 4700 FE |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
2 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 2000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |
|---|
