Process Hierarchy

Process characteristics:
must be 0.05 .. 1 µm
0.05 .. 1 µm
Material silicon dioxide
Temperature 700 °C
Uniformity 0.05
Wafer size
Wafer size
Equipment FNB1
Equipment characteristics:
Batch sizes 150 mm: 25
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 675 µm