Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Metal sputter deposition (Veeco)
Process characteristics:
Material
Material*
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 0.5 µm
0 .. 0.5 µm
Ambient
Ambient to which substrate is exposed during processing
 argon
Pressure
Pressure of process chamber during processing
 7 mTorr
Sides processed either
Wafer size
Wafer size
Equipment Veeco Connexion 800
Equipment characteristics:
Batch sizes 150 mm: 1
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, fused silica, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 900 µm