Process Hierarchy

  X-ray inspection
Process characteristics:
Duration of x-ray inspection
Duration of x-ray inspection, must be 1 .. 8 hour
1 .. 8 hour
Wafer size
Wafer size
Equipment x-tek Revolution
Equipment characteristics:
Batch sizes 10 .. 550 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
Brochure.pdf (3.1 MB, application/pdf)
attached by ozgur (Mehmet Ozgur) on 2006-02-01 14:09
tool information