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| Process characteristics: |
| Thickness |
|
|---|
| Material |
AZ 5214e |
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| Wafer size |
|
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| Equipment |
Photoresist Spray Coater |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1 |
|---|
| MOS clean |
no |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, Pyrex (Corning 7740), fused silica, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
20 .. 800 µm |
|---|
