Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Photoresist Spray Coat
Process characteristics:
Thickness
Thickness*
must be 0.5 .. 2.1 µm
0.5 .. 2.1 µm
Material AZ 5214e
Wafer size
Wafer size
Equipment Photoresist Spray Coater
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, Pyrex (Corning 7740), fused silica, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 20 .. 800 µm