Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Al, Al.5%Cu, Cu Single Layer Sputter
Process characteristics:
Material
Material*
Thickness
Thickness*
must be 250 .. 15000 Å
250 .. 15000 Å
Wafer size
Wafer size
Equipment RVM Sputter Tool
Equipment characteristics:
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25, 200 mm: 25, 50 .. 76 mm: 25