Process Hierarchy

  Al, Al.5%Cu, Cu Single Layer Sputter
Process characteristics:
Material
Material*
Thickness
Thickness*
must be 250 .. 15000 Å
250 .. 15000 Å
Wafer size
Wafer size
Equipment RVM Sputter Tool
Equipment characteristics:
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25, 200 mm: 25, 50 .. 76 mm: 25