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Development #1 - LaNiO3 (LNO) Deposition: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Development #1 - LaNiO3 (LNO) Deposition
Down
Batch size
8
Material
LaNiO3 (LNO)
Thickness
0 .. 0.2 µm
Comments:
Module/Task 1 - Developing LNO Process
o 8 wafers
o 0.1 um Thermal Oxide coating
o Spin customer supplied Sol-gel coating for LNO
o Hot plate bake DOE
o RTA DOE
o Thickness and XRD measurements
o Report