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E-Beam Resist Coat: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
on front
E-Beam Resist Coat
Process characteristics:
Material
Material
496K PMMA
950K PMMA
other
ZEP 520
Thickness
Thickness of film to be deposited.
Thickness
*
µm
nm
Thickness of film to be deposited., must be 0.1 .. 1 µm
0.1 .. 1 µm
Batch size
1
Sides processed
either
Equipment