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E-beam Resist Hotplate Bake: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Anneal
Bake
Oxidation
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
E-beam Resist Hotplate Bake
Process characteristics:
Material
Material
*
496K PMMA
950K PMMA
other
ZEP 520
Temperature
Temperature
°C
must be 25 .. 200 °C
25 .. 200 °C
Batch size
1
Equipment