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About MEMS
PZT Development module: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Evaporation
LPCVD
Low-stress SiN deposition
Miscellaneous deposition
Oxidation
PECVD
Spin casting
Sputtering
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
PZT Development module
Batch size
3
Material
PZT
Thickness
0 .. 1 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
100 mm
Wafer size
Wafer size
100 mm
Comments:
PZT actuator stack deposition and patterning on customer supplied wafers.