Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  PiezoMEMS - PZT based Actuator/Transducer module (Multi-Project-Run)
Batch size 20
Material PZT
Thickness 0 .. 1 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 150 mm
Wafer size
Wafer size
Comments:
  • Piezoelectric material: PZT (52/48)
  • Multi-project runs are shared runs. Several projects are run on the same wafer.
  • A full fabrication process enabling the creation of PZT thin film capacitors, actuators, and transducers.
  • Includes air bridge process to reduce parasitic capacitances
  • Customer to supply CAD layout for 7.5x7.5mm die
    Note – Full layout is updated twice annually
  • Build schedule 8-12 weeks
  • Process runs on regular interval for process qualification with the number of wafers completing the full process in excess of 4 per design cycle
  • See attached table for material properties.
  • The cross-sectional view illustrates the completed device geometries.
  • Please contact for additional information and a quote.
Attachments
[Thumbnail]PZT_module_MPR2.png (28.5 KB, image/png)
attached by ozgur (Mehmet Ozgur) on 2015-02-18 15:05
[Thumbnail]PZT_module_MPR1.png (366.4 KB, image/png)
attached by ozgur (Mehmet Ozgur) on 2015-02-18 15:05