Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  PiezoMEMS Photonics Module
Process characteristics:
Include_Air_Bridge
Indicates if the process includes fabrication of air bridge
Include_Air_Bridge*
yes no
Indicates if the process includes fabrication of air bridge
Mask Count
Mask plates that need to be made by the fab
Mask Count*
Mask plates that need to be made by the fab, must be 0 .. 10
0 .. 10
Batch size 1
Material PZT
Thickness 1 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 100 mm
Wafer size
Wafer size
Comments:
  • PZT thin film transducers will be fabricated on customer provided 100mm
    diameter substrates with a top surface consisting of a high temperature
    compatible SiO2 coating. PZT (52/48) films with the appropriate elastic
    layer and metallization layers will be deposited with a PZT thickness of
    approximately 1.0 micron. The transducers will use a bottom electrode
    comprised of Pt and a top electrode comprised of IrO2. The transducers will
    be patterned with a combination of ion-mill and wet etch procedures. Access
    to the top and bottom transducer electrodes will be provided with
    input/outputs coated with a tri-layer of Au/Pt/Cr.
  • Option for Gold Airbridge - This option to module adds gold airbridges as
    a means of reducing the stray capacitance associated with making electrical
    contact to the IrO2 top electrode contact of the PZT transducer.
  • Option for photomasks - Photomasks created using customer provided data
    with minimum dimensions of 3.0 micron with +/- 0.5um registration.