Process Hierarchy

  Dry oxidation (metal)
Process characteristics:
Thickness
Thickness of grown film.
Thickness*
Thickness of grown film., must be 0 .. 0.5 µm
0 .. 0.5 µm
Ambient
Ambient to which substrate is exposed during processing
nitrogen
Batch size 25
Material silicon dioxide
Pressure
Pressure of process chamber during processing
1 atm
Sides processed both
Temperature 1100 °C
Wafer size
Wafer size
Equipment Tylan Furnace (Silicide, Tube #7)
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator, silicon on sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm
Comments:
  • Use when metal residues of aluminum, titanium, and tungsten in silicide form are present on wafers.
  • Standard pre-diffusion clean at diffusion wet bench.
  • Prices listed for 1100 degC oxidation. Lower temperatures are available on request at higher cost.