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About MEMS
Anodic bonding (with alignment): View
Process Hierarchy
Bonding
Anodic bonding
Fusion bonding
Glass frit bonding
Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Anodic bonding (with alignment)
Process characteristics:
Pressure
Ambient pressure inside the chamber
Pressure
mbar
Torr
Ambient pressure inside the chamber, must be 5e-05 .. 760 Torr
5e-05 .. 760 Torr
Second substrate side bonded
Second substrate side bonded
*
back
front
Substrate side bonded
Substrate side bonded
*
back
front
Alignment type
Method used to align materials to be bonded.
optical
Ambient
Ambient to which substrate is exposed during processing
nitrogen
Batch size
2
Second substrate diameter
100 mm
Second substrate materials
Pyrex (Corning 7740), silicon
Second substrate thickness
300 .. 600 µm
Temperature
450 .. 500 °C
Voltage
1500 V
Wafer size
Wafer size
100 mm
Equipment
Karl Suss Bond aligner
Maximum bond stack height is 6mm
Equipment characteristics:
MOS clean
no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm
Comments:
Post-bonding alignment tolerance is 4um.