Process Hierarchy

on front
  HMDS prime (manual)
Batch size 1
Material HMDS
Pressure of process chamber during processing
1 atm
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment Solitec 5100
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • Prebake.