Process Hierarchy

on front
  DUV photoresist coat (Shipley UV210)
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer
Material Shipley UV210
Setup time 60 min
Sides processed either
Temperature 23 °C
Wafer size
Wafer size
Equipment SVG 8800 Photoresist coat and develop track
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 800 µm