Process Hierarchy

  Parylene C deposition
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 1 .. 25 µm
1 .. 25 µm
Material Parylene C
Pressure of process chamber during processing
0.1 Torr
Sides processed both
Temperature 24 °C
Wafer size
Wafer size
Equipment Parylene deposition system
Equipment characteristics:
Batch sizes 100 mm: 4, 50 mm: 6, 75 mm: 5
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
flat chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, alumina, glass (category), metal (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 10000 µm
  • Parylene C is an inert, hydrophobic, optically clear biocompatible polymer coating material used in a wide variety of industries. Because it is deposited by vapor deposition, Parylene provides a conformal coating on virtually any substrate which is not achievable by other means. Its lubricity is close to that of Teflon but can be applied uniformly in much thinner coatings, ideal for MEMS and BioMEMS based applications. Parylene's pinhole free conformal coating protects coated substrates from moisture, chemicals, and electric charge. While Parylene is typically used to coat circuit boards or immobilize particles, it can also be removed from the original surface and used as a microstamp allowing MEMS patterns to be transferred reproducibly to polymers with various properties.
  • Parylene properties are available from the manufacturer at
  • In single-sided depositions, another set of dummy wafers must be provided to cover the backside of the wafers.