Process Hierarchy

  Photoresist hardbake (102 degC)
Ambient to which substrate is exposed during processing
Batch size 24
Pressure of process chamber during processing
1 atm
Sides processed both
Temperature 102 °C
Thermal duration 30 min
Wafer size
Wafer size
Equipment Lindberg/Blue M mechanical oven
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • Developed photoresist coated wafer.