Process Hierarchy

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  Titanium E-beam Evaporation
Process characteristics:
must be 0 .. 1 µm
0 .. 1 µm
Material titanium
Sides processed either
Wafer size
Wafer size
Equipment CHA e-Beam Vacuum Evaporator System
Equipment characteristics:
Batch sizes 100 mm: 8, 150 mm: 5, 75 mm: 8
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
mechanical clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (fused silica), sapphire, gallium arsenide, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm