Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Spin Casting Manual Spinner
Process characteristics:
Material
Material*
Thickness
Thickness of film to be deposited.
Thickness*
Thickness of film to be deposited., must be 1.4 .. 25 µm
1.4 .. 25 µm
Batch size 1
Sides processed either
Wafer size
Wafer size
Equipment Headway Manual Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
 0 .. 75 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
 200 .. 2500 µm
Wafer holder
Device that holds the wafers during processing.
 aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 gallium arsenide, other, quartz (single crystal), silicon, silicon carbide, indium phosphide, sapphire, silicon on insulator, Pyrex (Corning 7740), quartz (fused silica)