Process Hierarchy

on front
  Contact I-line photolithography (AZ 5214 - MJB3) -Image Reversal-
  1 Prebake II
MaterialAZ 5214
MaterialAZ 5214
on front
  5 I-line exposure (MJB3)
Materialphotoresist (category)
MaterialAZ 5214
Materialphotoresist (category)
MaterialAZ 5214
  9 Hardbake I
Materialphotoresist (category)
Process characteristics:
Alignment side
Alignment side*
Perform hard bake
Perform hard bake*
yes no
Perform slow bake
Perform slow bake*
yes no
Resist thickness
Resist thickness
must be 1.1 .. 1.63 µm
1.1 .. 1.63 µm
Batch size 4
Magnification 1
Material AZ 5214
Sides processed either
Wafer size
Wafer size
Comments: