Process Hierarchy

on front
  Tungsten lift-off
MaterialShipley 1813
  1.1 HMDS Prime
MaterialHMDSThickness1 nm
MaterialShipley 1813
MaterialShipley 1813
on front
  1.5 Contact G-line exposure
Depth10 µm
MaterialShipley 1813
Materialtungsten
MaterialShipley 1813
Depth100 µm
Process characteristics:
Thickness
Thickness*
must be 0.1 .. 0.2 µm
0.1 .. 0.2 µm
Batch size 1
Excluded materials gold (category), copper
Material tungsten
Max field size 100 mm
Min feature size 5 µm
Resist thickness 1.3 µm
Wafer size
Wafer size
Comments:
Extra terms