Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Titanium/nickel DC-magnetron sputtering
on front
  1 Titanium/nickel DC-magnetron sputter
Materialtitanium/nickel
on front
  2 Stylus profilometer step measurement
Depth100 µm
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 2 µm
0 .. 2 µm
Excluded materials gold (category), copper
Material titanium/nickel
Wafer size
Wafer size
Comments:
  • Film thickness measurements are performed by stylus profilometry. A separate, partially-masked substrate is loaded along with each wafer and is used to measure the thickness of the as-deposited film.
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.