Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (Shipley 1813)
  1 Prebake
on front
  2 HMDS coat
MaterialHMDS
on front
  3 Photoresist coat (Shipley 1813)
MaterialShipley 1813Thickness1.3 µm
  4 Photoresist softbake
on front
  5 Optical Front-to-Front Alignment
on front
  6 Optical Exposure
  7 Photoresist develop (Shipley 1813)
MaterialShipley 1813
  8 Photoresist hardbake (110 degC)
Process characteristics:
Alignment side
Alignment side*
Batch size 1
Magnification 1
Material Shipley 1813
Resist thickness 1.3 µm
Wafer size
Wafer size
Comments: