Process Hierarchy

on front
  Low-stress polysilicon LPCVD
  2.1 RCA clean
  2.2 HF dip
MaterialpolysiliconResidual stress50 .. 100 MPa
Thickness0.01 .. 5 µm
Process characteristics:
Recipe
Please select one of the available recipes from the list.
Recipe*
Please select one of the available recipes from the list.
Thickness
Thickness*
must be 0 .. 1 µm
0 .. 1 µm
Batch size 24
Material polysilicon
Wafer size
Wafer size