Process Hierarchy

on front
  Parylene N deposition
MaterialParylene N
Refractive index1 .. 4Thickness0 .. 50 µm
Process characteristics:
Apply adhesion promoter
Apply adhesion promoter*
yes no
Measure film thickness
Measure film thickness*
yes no
Perform clean
Perform clean*
yes no
Amount of material added to a wafer
Amount of material added to a wafer, must be 0.1 .. 8 µm
0.1 .. 8 µm
Batch sizes 100 mm: 3
Material Parylene N
Sides processed both
Wafer size
Wafer size