Process Hierarchy

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  Zinc oxide (ZnO) RF-magnetron sputtering Down
Materialzinc oxide
Refractive index1 .. 4Thickness0 .. 50 µm
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0 .. 3 µm
0 .. 3 µm
Batch sizes 100 mm: 3, 150 mm: 2
Material zinc oxide
Wafer size
Wafer size
  • ZnO sputter target is ZnO.
    ZnO film thickness can only be measured on silicon substrates.