Process Hierarchy

on front
  Contact I-line photolithography (AZ 5214 - MA6) -Standard-
  1 Prebake II
  2 HMDS Prime
MaterialHMDS
MaterialAZ 5214
MaterialAZ 5214
on front
  6 I-line exposure (MA6)
Materialphotoresist (category)
MaterialAZ 5214
  8 Hardbake I
Materialphotoresist (category)
Process characteristics:
Alignment side
Alignment side*
Perform hard bake
Perform hard bake*
yes no
Perform prime
Perform prime*
yes no
Perform slow bake
Perform slow bake*
yes no
Resist thickness
Resist thickness
must be 1.1 .. 1.63 µm
1.1 .. 1.63 µm
Batch size 4
Magnification 1
Material AZ 5214
Sides processed either
Wafer size
Wafer size
Comments: