Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (Manual)
  1 HMDS Vapor Prime (Manual)
MaterialHMDS
on front
  2 Spin Casting Manual Spinner
  3 Manual Photoresist Softbake (hotplate)
  4 Contact flat alignment and exposure
  5 Photoresist Develop (Manual)
Resist thickness1 .. 6 µm
  6 Linewidth Microscope Measurement
  7 Microscope inspection
Process characteristics:
Alignment side
Alignment side*
Alignment tolerance
Registration of CAD data to features on wafer
Alignment tolerance*
Registration of CAD data to features on wafer
unconstrained
Alignment type
Choose fine alignment if the mask will be aligned to the marks on the wafer.
Alignment type*
Choose fine alignment if the mask will be aligned to the marks on the wafer.
Min feature size
Min feature size*
unconstrained
Perform hardbake
Hardbake is optional for AZ5214E only.
No hardbake procedure is available for AZ 9245.
UV Stabilization available for AZ5214e resist and 100mm and 150mm diameter wafers only.
Perform hardbake*
Hardbake is optional for AZ5214E only. No hardbake procedure is available for AZ 9245. UV Stabilization available for AZ5214e resist and 100mm and 150mm diameter wafers only.
Perform linewidth metrology
Two measurement per wafer
Perform linewidth metrology*
yes no
Two measurement per wafer
Perform microscope inspection
30 mins inspection per wafer
Perform microscope inspection*
yes no
30 mins inspection per wafer
Perform stylus profilometry
One measurement per wafer
Perform stylus profilometry*
yes no
One measurement per wafer
Resist thickness
Resist thickness*
Batch size 1
Magnification 1
Materials AZ 9245, AZ 5214e
Wafer size
Wafer size
Comments:
  • 50mm, 75mm, 100mm and 150mm diameter wafers can be accommodated, unless the UV stabilization option is selected for the "Hardbake". In this case, only 100mm and 150mm wafers can be handled.
  • The linewidth metrology includes measurements at two different sites on the wafer. Please provide details about the inspection sites, otherwise, if available only alignment marks will be inspected.
  • The microscope inspection includes only 30 mins of minimum inspection per wafer.
  • The stylus step-hight metrology includes only one measurement per wafer.
  • For any other or additional inspection, the customer will specify the location and nature of inspection, and it will be custom quoted.
  • See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.