Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (Shipley 220)
  1 Dehydration bake
  2 HMDS prime
on front
  3 Photoresist coat (Shipley 220)
on front
  4 Photoresist softbake
on front
  5 Contact front-front alignment
on front
  6 Contact G-line exposure
on front
  7 Photoresist develop (Shipley 220)
Batch size 1
Magnification 1
Material Shipley 220
Max field size 100 mm
Min feature size 15 µm
Resist thickness 10 µm
Wafer size
Wafer size