on front Protective coating for KOH etch (ProTEK) |
|
| Batch size |
25 |
|---|
| Material |
ProTEK B1-18 |
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| Sides processed |
either |
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| Temperature |
205 °C |
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| Thickness |
0 .. 2 µm |
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| Equipment |
Headway Programmable Photoresist Spinner |
| Equipment characteristics: |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
1 .. 6 inch |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular |
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| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 800 µm |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, glass (category), other, silicon |
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| Comments: |
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