Process Hierarchy

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  Protective coating for KOH etch (ProTEK)
Batch size 25
Material ProTEK B1-18
Sides processed either
Temperature 205 °C
Thickness 0 .. 2 µm
Equipment Headway Programmable Photoresist Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 6 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 800 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), other, silicon
  • The primer will be used to improve the adhesion of the main protective coating.
  • This step includes spin casting and bake of the protective coating. No additional curing is necessary.
  • The coats can be stripped with acetone or oxygen plasma.