Process Hierarchy

on front
  G-Line BCB process
on front
  5 G-line BCB cure
on front
  6 BCB Dry Etch
Process characteristics:
Material
3022-63: Non-photodefinable (12 -20um)
4024-40: Photodefinable (3 -7um)
4026-46: Photodefinable (6 -14um)
Material*
3022-63: Non-photodefinable (12 -20um) 4024-40: Photodefinable (3 -7um) 4026-46: Photodefinable (6 -14um)
Resist thickness
Resist thickness*
must be 3 .. 20 µm
3 .. 20 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
line
Field geometry
Shape of field with dimensions characterized by the maximum field size
circle
Min feature size 30 µm
Wafer size
Wafer size
MOS clean no
Comments:
  • Standard descum process after the cure.Benzocyclobutene (BCB) -based polymer dielectrics
  • CYCLOTENE* Advanced Electronics Resins from The Dow Chemical Company are high-purity polymer solutions that have been developed for microelectronics applications. The resins are derived from B-staged bisbenzocyclobutene (BCB) monomers and are formulated as high-solids, low-viscosity solutions.
  • Notable properties of the resins include:
  • * Low dielectric constant
    * Low loss at high frequency
    * Low moisture absorption
    * Low cure temperature
    * High degree of planarization
    * Low level of ionics
    * High optical clarity
    * Good thermal stability
    * Excellent chemical resistance
    * Good compatibility with various metallization systems
  • The resins are available in photosensitive and dry-etch grades.
  • See its properties at:
    http://www.dow.com/cyclotene/over.htm