Process Hierarchy

on front
  HMDS prime (Automated)
Batch size 1
Material HMDS
Pressure of process chamber during processing
0.1 mbar
Sides processed either
Temperature 90 °C
Wafer size
Wafer size
Equipment ACS200 coater/developer
  • Automated coater and developer. Also does vapor HMDS, and hotplate bakes.
Equipment characteristics:
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • Vapor prime