Process Hierarchy

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  Spin casting (Durimide)
Process characteristics:
Thickness of film to be deposited. (for cured films)
Thickness of film to be deposited. (for cured films), must be 2.7 .. 11 µm
2.7 .. 11 µm
Batch size 1
Material Durimide 115A
Sides processed either
Equipment Headway Programmable Photoresist Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 6 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 800 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), other, silicon
  • The Durimide 100 Series are a range of self priming, non-photosensitive polyamic acid formulations which become fully stable polyimide coatings after thermal curing. They can be photo-imaged using a positive photoresist mask. Softbaked polyimide films are coated with photoresist, softbaked, exposed and post exposure baked. When the photoresist is developed, the polyimide is etched, transferring the pattern from the photoresist into the polyimide. The photoresist is subsequently removed with a solvent rinse and the polyimide thermally cured. The minimum geometry which can be achieved by this method depends upon the thickness of the polyimide at softbake. The smallest resolvable feature is approximately four times the softbake film thickness.
  • Thickness of softbaked films ranges from 4um to 21um. Thickness range given in the process description above is for cured films.