Process Hierarchy

  Furnace anneal (Nitrogen)
Process characteristics:
Process duration
Process duration*
must be 5 .. 240 min
5 .. 240 min
must be 300 .. 1050 °C
300 .. 1050 °C
Anneal ambient nitrogen
Batch size 50
Wafer size
Wafer size
Equipment BTI Horizontal Tube Furnace
Equipment characteristics:
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 600 µm