Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Polyimide deposition, patterning and curing (Durimide 7520)
on front
  1 Spin casting (Durimide 7520)
  2 Polyimide Softbake (hotplate-Durimide 7520)
  3 Contact flat alignment and exposure
  4 Polyimide Develop (Manual- Durimide)
  5 Furnace anneal (Nitrogen)
Process characteristics:
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Curing temperature
Tube furnace: 300-400C.
Blue M Oven: 200-240C.
Curing temperature*
Tube furnace: 300-400C. Blue M Oven: 200-240C., must be 200 .. 400 °C
200 .. 400 °C
Curing time
Curing time*
must be 30 .. 240 min
30 .. 240 min
PI Curing tool
PI Curing tool*
Thickness
Cured thickness of material deposited.
Thickness*
Cured thickness of material deposited., must be 10 .. 40 µm
10 .. 40 µm
Material Durimide 7520
Wafer size
Wafer size