Process Hierarchy

  Wet oxidation
Process characteristics:
Perform clean
Perform clean*
yes no
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.05 .. 6 µm
0.05 .. 6 µm
Batch size 25
Excluded materials gold (category), copper
Material silicon dioxide
Pressure
Pressure of process chamber during processing
1 atm
Sides processed both
Wafer size
Wafer size