Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  5X I-line photolithography (OiR 897 10i)
  1 Dehydration bake
  2 HMDS prime
MaterialHMDS
on front
  3 I-line photoresist coat (OiR 897 10i)
MaterialArch OiR 897-10i
on front
  4 Photoresist softbake
Materialphotoresist (category)
on front
  5 5X stepper alignment and i-line exposure
on front
  6 I-line develop (OiR 897 10i)
MaterialArch OiR 897-10i
on front
  7 Microscope inspection
on front
  8 UV bake
Process characteristics:
Perform deep uv bake
Perform deep uv bake*
yes no
Resist thickness
Resist thickness*
Batch size 12
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Field geometry
Shape of field with dimensions characterized by the maximum field size
 square
Magnification 5
Material Arch OiR 897-10i
Max field size 10 mm
Min feature size 1 µm
Wafer size
Wafer size