Process Hierarchy

  Thermocompression Bonding
Process characteristics:
Bonding Ambient
Bonding Ambient*
Wafer size
Wafer size
Equipment Karl Suss SB6
Equipment characteristics:
Batch sizes 100 mm: 2, 150 mm: 2
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Corning 1737
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm