Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Anodic Bonding
Process characteristics:
Bonding Ambient
Ambient to which substrate is exposed during processing
Bonding Ambient*
Ambient to which substrate is exposed during processing
Wafer size
Wafer size
Equipment Karl Suss SB6
Equipment characteristics:
Batch sizes 100 mm: 2, 150 mm: 2
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, Corning 1737
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 1000 µm