Plasma Bond Activation and Non-Aligned Prebonding |
|
Ambient Ambient to which substrate is exposed during processing |
trifluoromethane, oxygen, carbon tetrafluoride |
Batch sizes |
100 mm: 2 |
Wafer size |
|
Equipment |
Plasmalab MicroEtch |
Equipment characteristics: |
MOS clean |
no |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
Wafer holder Device that holds the wafers during processing. |
aluminum chuck |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon carbide, silicon, gallium arsenide |
Wafer thickness List or range of wafer thicknesses the tool can accept |
0 .. 1000 µm |