Process Hierarchy

on front
  Undoped amorphous silicon LPCVD
  1.2 10:1 HF dip
Excluded materialsgold, Borofloat (Schott), Pyrex (Corning 7740)Temperature580 °C
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0 .. 2 µm
0 .. 2 µm
Batch sizes 100 mm: 24, 150 mm: 9
Excluded materials gold
Material amorphous silicon
Wafer size
Wafer size
Comments:
  • Glass wafers are NOT allowed!