Process Hierarchy

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  E-beam evaporation
Process characteristics:
Adhesion layer material
In necessary please specify the adhesion material.
Adhesion layer material
In necessary please specify the adhesion material.
Adhesion layer thickness
thickness of adhesion layer
Adhesion layer thickness
thickness of adhesion layer, must be 0 .. 300 Å
0 .. 300 Å
Material
Choose the main metal for evaporation.
Material*
Choose the main metal for evaporation.
Thickness
Allowed thickness ranges for main materials are as follows:
Al < 1um
Ti < 0.15um
Cr < 0.1um
Pt < 0.1um
Thickness*
Allowed thickness ranges for main materials are as follows: Al < 1um Ti < 0.15um Cr < 0.1um Pt < 0.1um, must be 0 .. 1 µm
0 .. 1 µm
Ambient
Ambient to which substrate is exposed during processing
nitrogen
Batch size 8
Sides processed either
Wafer size
Wafer size
Equipment Enerjet E-beam
  • Hemispherical dome for lift-off
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
rotating orbital
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), indium phosphide, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm