Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (automated)
Process characteristics:
Material
Material*
Perform prime
Include standard HDMS prime.
Perform prime*
yes no
Include standard HDMS prime.
Thickness
Please you the following ranges:
AZ 5214: 1.4 .. 2.8um
AZ 9260: 6 .. 20um
Shipley 1813: 1.3um
Shipley 1827: 2.7um
Shipley 220: 1.5 .. 4.5 um
Thickness*
Please you the following ranges: AZ 5214: 1.4 .. 2.8um AZ 9260: 6 .. 20um Shipley 1813: 1.3um Shipley 1827: 2.7um Shipley 220: 1.5 .. 4.5 um , must be 1.3 .. 20 µm
1.3 .. 20 µm
Batch size 1
Sides processed either
Wafer size
Wafer size
Equipment ACS200 coater/developer
  • Automated coater and developer. Also does vapor HMDS, and hotplate bakes.
Equipment characteristics:
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 800 µm