Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Direct laser write lithography (Manual)
  1 HMDS Vapor Prime (Manual)
MaterialHMDS
on front
  2 Spin Casting Manual Spinner
  3 Manual Photoresist Softbake (hotplate)
on front
  4 Direct laser write
  5 Photoresist Develop (Manual)
Resist thickness1 .. 6 µm
  6 Microscope inspection
  7 Manual Photoresist Hardbake (hotplate)
Process characteristics:
Min feature size
Min feature size*
must be 0.5 .. 10 µm
0.5 .. 10 µm
Perform microscope inspection
One measurement per wafer
Perform microscope inspection*
yes no
One measurement per wafer
Time
Time*
must be 15 .. 480 min
15 .. 480 min
Alignment side front
Batch size 1
Magnification 1
Material AZ 5214e
Perform hardbake yes
Resist thickness 1 .. 5 µm
Wafer size
Wafer size