Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (AZ P4400 / AZ 1518)
  1 HMDS Prime
MaterialHMDS
on front
  2 Photoresist coat (AZ P4400)
MaterialAZ P4400
  3 Photoresist softbake
Materialphotoresist (category)
on front
  4 Contact front-to-front Align & Expose
  5 Photoresist develop (AZ P4400)
MaterialAZ P4400
on front
  6 Photoresist descum
Materialphotoresist (category)
Process characteristics:
Alignment side
Alignment side*
Perform backside protect
Perform backside protect*
yes no
Perform hard bake
Perform hard bake*
yes no
Resist thickness
AZ 1518 :1.5 .. 2.5 µm
AZ P4400:3.3 .. 5.0 µm
Resist thickness*
AZ 1518 :1.5 .. 2.5 µm AZ P4400:3.3 .. 5.0 µm, must be 1.5 .. 2.5 or 3.3 .. 5 µm
1.5 .. 2.5, 3.3 .. 5 µm
Batch size 4
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 equal line space
Field geometry
Shape of field with dimensions characterized by the maximum field size
 circle
Magnification 1
Materials AZ 1518, AZ P4400
Max field size 200 mm
Min feature size 1 .. 5 µm
Photoresist polarity positive
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 75 .. 200 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), silicon, silicon on insulator
Wafer size
Wafer size
Comments: