Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (SU-8) Down
  1 Dehydration bake
on front
  2 HMDS prime (manual)
MaterialHMDS
on front
  3 Photoresist coat (SU-8)
MaterialSU-8Thickness200 µm
  4 Prebake (SU-8)
MaterialSU-8
on front
  5 Contact front-front align & expose
on front
  6 I-line exposure Deleted
Materialphotoresist (category)
  7 Post-exposure bake (SU-8)
MaterialSU-8
  8 Photoresist develop (SU-8)
Depth200 µmMaterialSU-8
  9 IPA rinse and dry
Magnification 1
Material SU-8
Resist thickness 200 µm
Sides processed either
Wafer size
Wafer size
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